lh3330/trs-x doc. no : qw0905- rev. : date : 06 - jun. - 2006 b data sheet lh3330/trs-x tape and reel type led lamps ligitek electronics co.,ltd. property of ligitek only
page 1/5 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lh3330 ligitek electronics co.,ltd. property of ligitek only lh3330/trs-x package dimensions part no. h1 f w2 h p2 w0 l h2 t p p1 w1 w3 d 5.0 5.9 0.5 typ 2.54typ 25.0min 1.0min 7.6 8.6 1.5max + -
-40 ~ +100 tstg storage temperature forward voltage @20ma(v) luminous intensity @10ma(mcd) spectral halfwidth nm viewing angle 2 1/2 (deg) material peak wave length pnm part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. gap lh3330/trs-x 4.5 typ. 697 red red diffused 3.0 2.6 1.7 90 emittedlens min. max. min. 36 soldering temperature typical electrical & optical characteristics (ta=25 ) color tsol max 260 for 5 sec max (2mm from body) page2/5 part no. reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 forward current power dissipation parameter 15 ma i f t opr ir -40 ~ +85 10 pd i fp 40 60 a ma mw symbol h ratings unit ligitek electronics co.,ltd. property of ligitek only lh3330/trs-x
page3/5 inch mm inch maximum mm symbol specifications minimum ligitek electronics co.,ltd. property of ligitek only part no. lh3330/trs-x symbol items dimensions symbol information ? option code 0.12 0.73 0.08 3.0 0.09 18.5 0.69 ------- 2.0 1.12 1.04 0.93 0.82 28.5 26.5 1.08 1.0 20.9 23.5 0.78 0.89 0.850.89 22.5 2.3 17.5 ------- f h 27.5 25.5 19.9 22.5 h1 21.5 0.79 1.0 1.42 0.76 20.0 25.5 0.75 0.96 36 19.4 ------- 0.72 0.51 0.3 0.23 13.0 0.49 7.7 0.2 0.175.8 0.43 11.0 19.0 24.5 ------- 18.4 h2 12.4 5.1 4.4 p p2 p1 lw0 24.00.940.98 25.0 component lead pitch front-to-rear deflection feed hole to bottom of component lead location center of component location feed hole to overall component height lead length after component height feed hole pitch ------- ------- ------- ------- ------- ------- trs-10 trs-9 trs-4 trs-6 trs-7 trs-8 trs-5 trs-1 trs-2 trs-3 ------- ------- tape feed hole diameter d3.80.150.17 4.2 0.38 0.16 0.61 9.75 0.33 4.0 0 0.5715.5 0.690.75 19.0 8.5 0 14.5 w0 w2 w1 w317.5 package dimensions ? d d2 d1 mminch maxmum 102 38.1 88.0 4.02 1.5 3.46 14.96 380 marking d3 tape width adhesive tape width dimensions symbol information ? adhesive tape position feed hole location mm symbol 34.9 13.8 28.6 d2 d3 d1 78.2 d core diameter reel diameter description arbor hole diameter hub recess inside diameter remark:trs=tape and reel straight leads minimum 3.08 1.13 0.54 1.37 inch specification ------- ------- ------- ------- 50.01.97 30.0 t1 quantity/reel iside reel flange thickness 1000pcs 1.18 t2 overall reel thickness t1 t2 2.25 57.2 overall taped package thickness ------- t -------------- 0.06 1.42
1.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) 1000 900 800 700 600 wavelength (nm) fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 1.0 0.8 -40 0.9 -20020406080100-40 0.0 1.0 0.5 -20 80 40 20 060100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature forward voltage(v) fig.3 forward voltage vs. temperature 1.1 1.0 1.2 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 100 10 1000 2.03.0 2.0 3.0 2.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 4.05.01.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage h chip part no. 101001000 page4/5 lh3330/trs-x fig.6 directivity radiation
this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. ligitek electronics co.,ltd. property of ligitek only 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. high temperature high humidity test thermal shock test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition test item description reliability test: part no. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard 5/5 page lh3330/trs-x
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